Process

Electroforming Process

Smooth aperture walls, good paste release
Provides higher paste transfer efficiency
Have higher tensile strength and hardness
Repeatable paste release below surface area ratios of 0.5 (subject to the solder paste type as well as squeegee pressure)

Can be produced in non-standard thicknesses
Smallest Gap: 15μm
Smallest Pitch: 80μm
Smallest aperture: 50μm (+/- 5μm)
Aperture Accuracy: Ｗ２±5μｍ
Aperture-Inside Roughness: within 1μm
Accuracy of a thickness (step/non step): ±5μｍ
Thinnest achievement: 0.6mil

Laser Cut & Milling

The Tannlin T11 is our latest innovation in stencil laser systems The ultra-fast, highly integrated laser stencil cutting machine incorporates simultaneous automatic optical inspection, to guarantee perfect laser cut apertures for the highest performance stencils in electronics assembly processing.

Miling Stencil

Z-Axis dimensional accuracy within 5μm

Complete edge control ensures a consistent angle and radius allowing apertures to be designed closer to steps and pockets

A more gradual transition in stepped areas can extend the life of the squeegee an
stop paste build-up within the transition

Controlled smooth transition between steps

Avoids deposition and hardening of paste
Decreased chance of damage to squeegee blade

Surface roughness in stepped areas similar to the original material

Less paste smearing
Reduced wiping frequency
Lower print pressure required

More repeatable printing process

Thickness accuracy increased
Constant accuracy in removal of material

Electro Polishing

Optimum for fine pitch printing.
Improvement of finishing for aperture wall surface after laser-cutting.

Making aperture's surface more smooth and obtained far better paste release performance, compared to our standard.

Cavity Stencil

Regular Specification

Thickness: 0.10 to 0.15mm (under 0.1mm, need to discuss)
Metal Size Available → Max 500*400
Minimum Cavity Dimension → 1.0mm
Minimum Distance (B) → 0.30 mm (thickness 0.1mm)
Minimum Distance (C) → 0.15 mm
Minimum Distance (D) → 0.30 mm
Minimum Distance (E) → 0.10 mm
Minimum Space / Rib (F) → 0.10 mm (depends on its pattern and opening shape)

Tolerances

1. Cavity Dimension X, Y Sizes ±0.02

※(Drill diameter Ø 0.5 or less, need to be discussed)

2. Cavity Depth ±0.02

※(Drill diameter Ø 0.5 or less, need to be discussed)

3. Thickness ±0.01

4. Opening Accuracy ±0.01

The Following information required

Cavity Dimension (X, Y Sizes)
Cavity depth
Cavities' rounded corner R (min 0.25) see right side

BON MARK INTERNAL PRINTING TEST IN SQUEEGEE

Normal Plain SQ

Dimpled SQ

Inside paste, solder particle movement is not enough active, which makes the paste still sticky (Less Move)

After squeegee stroke and when suqeegee head goes up, you can see the less amount of solder paste is brought up with squeege in Dimpled Squeegee (Right Photo), compared with (Left Photo –without dimpled)

Dimple (Nimfron) blade

Metal blade

Observation

Nimfron plating blade perform better rolling effect compare with current blade.